Base
Zinc Oxide
Water-Based
Synthetic
Solvent-based (Polyurethane)
Silicone
Rubber and solvent
Polyurethane
Organic
Graphite
Epoxy Resin
Ep-140 (base)
Acrylic Resin
Acrylic
Heated Bed
Yes (Pei)
Paintable
Yes (After Cure)
No
Flux Core
Yes
Glowcore
UV Prot.
Yes
With Brush
Yes
Disposable
Yes
Halogens
Yes
Flammable
Yes
Corrosion Prot
Yes
Lubrication
Yes
Eutectic
Yes
Sealing
Yes
Moisture Proof
Yes
Water resistance
Yes
Biodegradable
Yes
Lead-free
Yes
Silicone Free
Yes
Lead Free
Yes
No Glue
Yes
N-Hexane Free
Yes
Water Resistant
Yes
Washable
Yes
Uv Resistant
Yes
Ultrasonic Safe
Yes
Thermal Interface
Yes
Solvent Free
Yes
RoHS Compliant
Yes
RoHS compliant
Rohs Compliant
Yes
Not Specified
Rohs Compliance
Yes
Rohs
Yes
Not Compliant
Not Compatible
Non-Compliant
No
Compliant
Reworkable
Yes
No
Reusable
Yes
No
No Clean
Yes
Low Foam
Yes
Leaded
Yes
Lead-Free
Yes
Halogen Free
Yes
Flame Retardant
Yes
Electrical Insulator
Yes
Digoutable
Yes
Die-Cuttable
Yes
Cuttable
Yes
Corrosion Protection
Yes
Conductive
Yes
Thermally Conductive
Adhesive
Yes
Silicone
Self-adhesive
Self-Adhesive
Pressure-Sensitive
Permanent
One-Sided
Non-Adhesive
Glueless
Conductive Acrylic
Acrylic
Color
Yellowish-brown
Yellow/black
Yellow
White/Cream
White
Transparent Amber
Transparent
Translucent White
Translucent To Amber
Silver-Grey
Silver-Gray
Silver
Pink
Pale yellow
Not Specified
Natural Steel
Natural (White)
Multiple Colors
Multicolor
Milky White
Metallic
Light Yellow
Light Gray
Light Amber
Grey
Green
Gray
Gold
Dark Gray
Copper
Colorless to pale yellow
Colorless
Clear/Yellowish
Clear/transparent
Clear Amber
Clear
Blue
Black/gray
Black On White
Black
Beige
Assorted
Amber
Design
X4
Weave Type
X-Braid
Flux Type
WS482 (Water-Washable)
Water-Washable
Water-soluble
Water-Soluble
Water Washable
Rosin Core
No-clean (no washing required)
No-clean
No-Clean
No Clean
Glowcore, No-Clean
Glowcore Rosin
Glowcore (No-clean)
Glowcore (NoClean)
Glowcore
Type
Wire Solder
Wire
Water-soluble Lead-free
Water-Based
UV-Curable Varnish
Universal
Two-Part Epoxy
Two-component
Tubular
Tube
Transfer Tape
Thin-walled
Thermal Paste
Thermal Pad
Thermal Gel
Temperature Sensor
Technical composition
T5
Solvent
Solid wire
Solder Wire
Solder Pieces
Solder Paste
Smt Single Splice
Single Splice
Silver-Filled Epoxy
Silicone-free
Silicone Adhesive
Shellac Varnish
Self-amalgamating Tape
Sanitizer Gel
Rtv Silicone
Rosin
Rma
Ribbons
Rf Polyurethane Resin
Pth Breadboard
Protective Coating
Pro Cleaner
Polyurethane Varnish
Polyurethane resin
Polyurethane Compound
PCB cleaner
Optical Compound
One-Part Epoxy
Non-Silicone Thermal Compound
Non-Silicone
No-Clean Paste
No-Clean
Neutral Cure Silicone
Mixing Nozzle
Light Diffusing
Lead-free
Humidity Indicator
Hot Glue
High-temp Grease
Heat Shrink Sleeve
Flux paste
Flat Heatpipe
Epoxy Underfill
Epoxy Resin
Epoxy Putty
Epoxy enamel
Epoxy Compound
Epoxy base
Epoxy
Emi Absorb
Electronics Grade Silicone
Contact Oil
Contact Grease
Contact
Cleaning Agent
Braided Cord
Approver
Adhesive Tape
Acrylic Varnish
Acrylic Conformal
Acrylic
2-Part PU Compound
2-part Enamel
2-component Polyurethane
1K Polyurethane
Form
Wire on Spool
Wire
Wafer
Two-Part Potting
Tubular Wire
Tubular
Syringe Paste
Syringe
Strip
Spool
Solid Wire
Solder Paste
Sleeve
Sheet
Ready Mix
Pen
Paste
Liquid
Gel-paste
Gel
Duosyringe
Coil
Cartridge Paste
Aqueous solution
Aerosol
Application
Wire Insulation, Chemical Systems, Medtech, Industrial
Vinyl Transfer, Graphics
Universal
Underfill For Pcb Assembly
Thermal Interface For Heatsinks And Power Electronics
Thermal Interface
Thermal Gap Filling
Thermal Bonding
Syringe or Spatula
Surface protection
Surface Mount
Stencil, Syringe
Stencil Printing
Stencil Cleaning
Spray, Dispenser, Selective
Spray, Brush, Immersion
Spray, Brush, Dip
Spray-In-Air
Spray or Sponge Apply
Spray
Soldering, Rework
Soldering Iron Tip Maintenance
Soldering Devices
SMT, Stencil Print
Smt Tape Splicing
Smt Reflow
SMT mount, PCB repair
Smt
SMD/SMT Mounting
Smd/smt Assembly, Manual And Automatic Dispensing
Smd, Tht
Smd, Through-Hole
Smd, Pcb
Smd, Bga, Qfp
SMD, BGA Mounting
SMD Mount
Smd / Tht
Smd
Shielding, contacts, repair
Sealing, potting, repair
Sealing, Molding, Electrical
Sealing, Insulation
Sealing & Bonding
Rf/emi Shielding
Rf Shielding
Repair, bonding, coating
Potting, Repair, Sealing
Potting, Bonding, Repair
Potting Compound
Pcbas
PCB Protection
Packaging Humidity Control
Package Control
Optical Bonding
Metal, Plastic, Stone
Metal & Wood
Led Modules
Leather, rubber, wood, PVC
Insulation, Sealing, Repair
Insulation, Dampening, Pack
Industrial, Household
Industrial Warning
Heat Transfer
Heat Dissipation Gap Filler
Heat Dissipation Between Components
Heat Dissipation
Gap Filling (Gpu/heatsink)
Gap Filler Between Ic And Heatsink
Gap Filler
For Wood
For PCB soldering
Fabric And Trim Bonding
Emi/rfi Shielding
Emi Shielding; Grounding; Pcb Repair
Emi Shielding
Electronics, PCB Assembly
Electronics, Instruments, Comms
Electronics, Floors, Enclosures
Electronics Soldering, PCB Repair
Electronics soldering
Electronics Soldering
Electronics Smt/pth
Electronics Cooling (Cpu, Gpu, Leds)
Electronics Cooling
Electronics Assembly (Smd/tht)
Electronics & PCB Soldering
Electronics
Electronic Soldering
Electrical Insulation, Labs, Medtech
Dispensing, Syringe Or Manual
Dispensers
Decorative, Packaging
CPUs, heatsinks, electronics
Cpu, Power Electronics
Cpu, Gpu, Power Ics
Cpu, Gpu, Power Devices
Cpu, Gpu, Heatsinks
CPU, GPU, Chipsets
Cosmetics, Candles, Printing, Insulation, Lubes
Contacts, Terminals, Connectors
Contacts, Shielding, Repairs
Construction / Installation
Cleaning
Casting, Sealing, Coating, Elastomers
Casting, Coating, Adhesives
Casting, bonding, composites, electrical insulation
Cable Insulation
Brush, Spray, Dip
Brush, Roller, Spray
Bonding And Potting
Bearings, Guides, Threads
Battery Tab
Battery Spot Welding
Apply Thin Layer to Film Surface
Adhesives & Sealants
Shape
Wire
Stick
Square
Spool (Wire)
Spool
Rectangular
Rectangle
Plates
Pieces
Paste
Lump/Piece
Liquid
Ingots
Gel
Flat
Cylindrical
Cored Wire
Bar/stick
Aerosol
Solder Form
Wire
Durability
Weatherproof
Indoor/outdoor
High
Safety
Wear Gloves & Goggles
Use protective equipment
Use PPE
Refer Sds
Non-toxic
Non-Flammable
Non-corrosive, Abrasive-free
Non-Corrosive
Non Flammable
Low Toxicity
Flammable Use Ventilated Area
Flammable
Odor
Weak
Solvent-based
Solvent
Neutral
Near Odorless
Minimum
Mild solvent
Low Odor
Light Citrus
Light Alcohol
Characteristic
Solder Meth
Wave, Selective
Flux Residue
Water-Washable
Rosin-Based
Solubility
Water-soluble
Water-Soluble
Water Insoluble, Solvent Soluble
Water Resistance
Water-resistant
High
Resistance
Water-repellent, Heat-resistant
UV & Weather resistant
Moisture & Uv
Low
Chemical/Mechanical
Chemical, Weatherproof
Chemical & Abrasive
Anti-corrosive
10^6-10^8
Indicator Type
Visual (Chemical)
Consistency
Viscous paste
Viscous
Soft
Paste-like
Paste
Nlgi 2
Liquid
Gel
Physical state
Viscous liquid
Appearance
Viscous Liquid
Gray Paste
Glossy
Material
Vinyl
Urethane
Uhmwpe
Tin alloy
Thermally Conductive Silicone
Thermally Conductive Polymer
Thermal Silicone
Thermal Pad (Silicone)
Thermal Pad
Thermal Interface Pad
Thermal Interface
Thermal Bonding Film
Steel
Stainless Steel
Solder
Silicone-based
Silicone-Based
Silicone Thermal Pad
Silicone Rubber
Silicone
Self-adhesive Tape
Self-adhesive paper
Reagent Paper
Pure Nickel (Ni200)
Pure Nickel (Ni)
PTFE (Teflon)
Ptfe (Teflon)
Polyurethane Resin
Polyurethane
Polypropylene
Polyolefin
Polymeric
Polyimide (Kapton)
Polyethylene (PE)
Polyester
Pla
Pet
Not Specified
Nickel
Metalized Pet Film
Metal Alloy
Metal
Lead-free tin alloy
Glass
Fr4
Foam
Film (Plastic)
Ferrite Composite
Elastomer
Crs (Cold Rolled Steel)
Copper Foil With Conductive Adhesive
Copper Foil
Copper Alloy
Copper
Cold Rolled Steel
Bond-Ply Tbp800
Aluminum
Aluminium Oxide (Al2O3)
Aisi 304
Adhesive Film
Absorbing Layer
Brand
Viksint
Staloc
Sn100C Glowcore
Glowcore
Chem Resistance
Very High (Acids, Alkalis, Solvents)
Oil & Solvent Resistant
Medium
High (Oil, Solvents)
High
Good
Thickness
Varies / Not Specified
Variable / Cut-To-Fit
Unspecified
Thin Film
Not Specified
5.0 Mm
5 mm
4.0 Mm
2.5 Mm
2.00 Mm
2.0 Mm
2 Mm
2 Mil
1.6 Mm
1.5 Mm
1.25 Mm
1.0 Mm
1 Mm
0.8 Mm
0.76 mm
0.5 Mm
0.254 Mm (0.010 In)
0.2 Mm
0.152 Mm (0.006 In)
0.15 Mm
0.125 In (3.175 Mm)
0.1 mm
0.13 Mm
0.05 mm
0.05 Mm
0.040 In (1.02 Mm)
0.020 In (0.51 Mm)
0.015 In
0.008 In
Safety Prec.
Use PPE; Keep away from fire
Eye and Skin Protection
Precautions
Use Gloves and Goggles; Avoid Open Flame
Connectivity
Usb / Sd / Wi-Fi
Formulation
Urethane-Based Two-Part
Thermally Conductive
Ready Mix
1-Part
Code
Urethan71
Ur5634Rp250Ge
Sga20S
Heat Resistance
Up to 80 °C
Up to 260 °C
Up to 150°C short-term
Increased
High
-50 to +200 °C
200°C
Shrink Ratio
Up to 50%
2:1
Current Rating
Up To 50 A
Layer Thick
Up to 5 mm per layer
30 m
2050 µm
Dry Time
Up to 5 min
Touch 30 Min; Full Cure 24 H
3060 Min (20°C)
20m (Tack) / 24h (Full)
2-4 Hours
15-30 min @ 20°C
15-30 min
1530 Min
Temperature Range
Up To 450°C
060 °C
-60° to +250°C
-40 To 85 °C
-40 To 200 °C
-40 To 150 °C
-40 To 130 °C
-40 To 120°C
-40 °C To 150 °C
-40125 °C
-40+85 °C
-20°C To 80°C
-20°C To +150°C
Shelf Life
Up to 36 mo
Up to 2 Years
Sealed Storage
Not Specified
6 mos (@ +4°C)
6 mos
6 months @ +4 °C
6 Months (Refrigerated)
6 Months
612 Months
5 Years
36 Months
3 Years
24 Months Unopened
24 Months
24 months
24 mo.
2 Years
12m (Dry, Dark)
12 Months @ 20°C
12 months @ +5+25°C
12 Months (Unopened)
12 Months (Sealed)
12 Months (Refrigerated)
12 Months (at 210 °C)
12 Months (525°C)
12 months
12 Months
Voltage
Up to 300 V
12 V
Soldering Temp
Up to 260°C
Op Temp
Up to 250°C
Up to +80°C
Up to +260°C
220-260 °C
2040 °C
20250 °C
0-40°C
-50°C+150°C
-40°C to +90°C
-40°C to +120°C
-40°C +120°C
-40120°C
-40+150 °C
-40+120 °C
-20°C to +40°C
40+120°C
40+120 °C
Heat resistance
Up to 200 °C
Temp Rating
Up To 1600 °C
Temperature resistance
Up to +60°C
Compatibility
Universal Mounting
Universal
Stainless Steel, Enamel, Glass
Solder Fluxes
Smt Pick-And-Place
Safe for metals; test on plastics
Reels, Multiplier
Plastic & Glass
PGA Chips
PCBs, Wires, Contacts
PCBs, SMD
Pcb Components
Packaging Lines
Most Varnishes
Metals, Plastics, Ceramics
Metals, Ceramics, Plastics
Metals, Ceramics
Metal/Plastic/Rubber
Metal, Plastic, Rubber
Metal, Plastic, Glass
Metal, Ceramic, Thermal Pads
Metal Contacts, Alloys
Manual & Machine Lines
Lead-free alloys
Lead-free & leaded solders
For Dispensers and Auto Systems
FDM/FFF Printers
Epoxy resins
CPU/GPU/Heatsinks
Compatible with Fuser Films/Foil
Aqueous System Compatible
8Mm Carrier Tape / Smt Feeders
6S3P Battery Packs
25 & 50 ml Cartridges
Purpose
Universal
Tape Splicing
Soldering Shield, Insulation
Solder
SMD & THT
Selective soldering
Repair/Bonding
PCB Cleaning
Ovens, Grills
Oven & Grill
Metal & Concrete Repair
Manual assembly/repair
Industrial Soldering
Industrial Equipment
Heat Transfer
General Purpose
Fuser Film Lubrication
For Varnishes
For Metal and Plastic
For metal
For Fishing
For Electronics
Flux & residue removal
Fishing
Electronics Soldering
Electronics Cleaning
Electronics & SMD Soldering
Electronics
Electronic Soldering
Dispensers
Copper Deposition
Contact Cleaning/Lubricating
Canning, Storage
Insulation
Uninsulated
PTFE (Teflon)
Technology
Ultrasonic
Flammability
Ul 94 V-0
Non-Flammable
Flammable
Country
Ukraine
Particle Size
Type 4 (2545 m)
Type 4
Type 3
T4
Small/Medium
45-75 m
45 m
25 µm
2545 m
1525 µm
Stencil
Type 4
Powder Sz
Type 3 (25-45 m)
1525 µm
Powder Size
Type 3 (2545 m)
Sc10
Glue Type
Two-component Epoxy
Composition
Two-component
Synthetic Polymers
Sn99.3 Cu0.7
Sn96.5Ag3.0Cu0.5
Sn96.5 Ag3.0 Cu0.5
Sn63Pb37
Sn-Cu-Ni, Lead-free
Sn-Cu-Ni (controlled)
Sn-Cu alloy
Sn-Based
Sn 96.5%, Ag 3.0%, Cu 0.5%
Sn 62% / Pb 36% / Ag 2%
Silicone base
Shellac, Solvent
Rosin, Activators
Polyurethane resin
Organic Solvents (Hexane-free)
Isopropyl Alcohol
Epoxy Resin
Corrosion Inh, Solvent
Contains No Silicones
Anionic Surfactants, Solvents, Water
96.5Sn/3.0Ag/0.5Cu
63% Sn, 37% Pb
63% Sn / 37% Pb
2-component
Components
Two-component
Two-Component
Resin & Hardener
2 Components
Solder Type
Tubular
Leaded
Flux-Cored
Eutectic
Core Type
Tubular
Glowcore
Flux-cored
Flux Core
Packing
Tube
Jar
Cartridge, Jar
Box
600 g Cartridge
Transparency
Transparent
Drying Time
Touch 1020 Min; Full Cure 24 H
624 h
30m (Surface), 24h (Full)
30 min
10-20 min
12 h Tack-free, 24 h Full
12 h
Solvent
Toluene-Free
R-4 or White Spirit
Organic (toluene/xylene)
Organic
N-hexane Free
Aqueous
Series
Tlbsa3500
Tgf 2000
Spk4
Sil-Pad Tsp 3500 / Sil-Pad 2000
Mf Tpa 2
M8
Hm
Gel37
Bmi-S-201
Alloy
Tin-Copper
Sn99.3Cu0.7
Sn97.5Ag2.5
Sn96.5Ag3.0Cu0.5
Sn63Pb37 (Eutectic)
Sn63Pb37
Sn63/pb37
Sn62Pb36Ag2
Sn60Pb40
Sn100C
Sac305 (Sn96.5Ag3.0Cu0.5)
Sac305 (Sn96.5 Ag3.0 Cu0.5)
SAC305 (Sn 96.5%, Ag 3.0%, Cu 0.5%)
Sac305 (96.5Sn/3.0Ag/0.5Cu)
Sac305
Rel61
Rel22
Lead-free SnAgCu
Lead-free Sn-Cu
In100
18% Ni
Tin Content
Tin Powder Present
63%
62%
Plating
Tin Plated
Tin
Nickel
Finish
Tin Plated
Solderable
Smooth Finish
Shiny
Semi-Gloss
Oxide-Free
Not Specified
Nickel Plated
Mill Finish
Metallic Gloss
Matte
Hasl (Lead-Free)
Glossy Metallic
Glossy
Gloss
Bright
Anodized
Mount
Through-Hole
Viscosity
Thixotropic Paste
Thixotropic
Thick Paste
Paste-like
Not Specified
Medium-High, Syringe Grade
Medium (Paste)
Medium
Low, Easy Application
Low
High, Paste-Like
High Viscosity Paste
High Viscosity
High (Paste)
Gel-Like
8001200 mPa·s
8,00015,000 Mpa·s
65,000 Mpa·s (25°C)
5000 mPa·s
500 mPa·s (25°C)
50,000 mPa·s
50150 Mpa·s
4500 mPa·s
3000 Mpa·s
3000 Cp
30 Cp
2500 mPa·s
2500 Mpa·s
250 mPa·s
2000 mPa·s
20,000 Mpa·s
2060 S (Din 4)
2040 Mpa·s (20°C)
1825 s (Ford #4, 20°C)
15000 Mpa·s
150300 Pa·s
15,000 Mpa·s
15,000 Cp
12000 mPa·s
120180 Pa·s (25 °C)
100000 Cp
1020 Pa·s (25°C)
<200 Pa·s
~5,000 Mpa·s
10,000 Mpa·s
Usage
Thinning/Cleaning
Thermal Interface For Electronics
Tape Splicing
Smt Assembly
Restores Oxidized Tips
Electronics, soldering
Electronics Soldering
Decoration, Packaging, Crafts
Attachment
Thermally conductive adhesive
Thermal Conductivity
Thermally Conductive
Not Specified
6.0 W/mk
6 W/mk
5 W/mk
5 W/m·k
4.0 W/mk
3.7 W/mk
3.7 W/m-K
3.0 W/mk
2.5 W/m·k
2.0 W/mk
1.5 W/mk
1.5 W/m·k
1.25 W/mk
1.1 W/m·k
0.97 W/m·k
0.8 W/m·k
0.6 W/m·k
0.23 W/m·k
0.20 W/m·k
0.2 W/mk
0.2 W/m·k
0.125 W/m·k
~10 W/m·k
Thermal
Thermally Conductive
Product Type
Thermal Pad
Thermal Interface Pad
Thermal Gap Filler
Solder Tip Tinner (Activator)
Reflow Cleaner
Non-Silicone Heat Transfer Compound Plus
Liquid Silicone Adhesive
Heatsink
Heat-Shrinkable Tube
General Purpose Electrical Potting Compound
Gap Filler
Flux-Cored Solder
Crimp Terminal
Line
Therm-A-Gap
Model
Tflex 780
Tci800-01180118-010-1Pc
St 2233
Sms1716C
PK-68
Hts01K
Ffl10S
F1
Estx(50)-9X10Mt0859
Aos 218
209Axt
Runtime
Temperature dependent
3060 min (20°C)
20 min
Thixotropy
T5
Particle Class
T5
Part Size
T4
25 m
Part. Class
T4
Particle Type
T3
Package
Syringe/Cartridge
Syringe SC10, 10 g
Syringe
Spool
Smd
Roll
Plastic Bottle w/ Brush
Cardboard Box
Canister
Box
500 ml Bottle
1 Box
Apply Method
Syringe, Micro-dosing
Spraying, Wiping
Spray, Brush, Roller
Spray, Brush, Dip
Brush, Swab
Brush, Sprayer
Packaging
Syringe
Mount Type
Surface Mount (Smt)
Solder
Pcb / Panel
Board Mount
Storage
Store In A Cool, Dry Place
Store at 525°C, Dry Place
Room Temperature
Refrigerate
Keep in dark, 425°C, sealed
Dry, +5+25 °C
Dark, +525°C
Dark Dry Place, +5+25°C
Cool, Dry Place
Cool, Dry
6 months at 525°C
525°C
525 °C
28°C
025 °C
+4°C, Dry Place
+2+8 °C
Printing Method
Stencil Printing
Reflow Profile
Standard Reflow
Core Diameter
Standard Core (1 In)
1 Inch (25.4 Mm)
Core
Standard Cardboard Core
Single-core
Flux-Cored
Flux-core
Flux
Temperature
Standard
From +5°C to +30°C
560°C
183 °C
+5°C to +35°C
+5+35 °C
-40°C To 125°C
-40 to +120°C
-40 to +120 °C
-200+260 °C
-20+80 °C
40+120 °C
Angle
Standard
Thermal Grade
Standard
Advantages
Stable flow, No-clean, Manual/Machine soldering
Excellent Wetting, Stable Melting
Format
Square Sheet
Sheet
Paste
Cards
Card
Aerosol
Pad Shape
Square
Reel Type
Sprocket Tape
Usage Method
Spray, Dip or Blow
Apply small amt, rub till dry
Add to Solution While Stirring
Connection Type
Spot Weld
Supply
Spool, by meter
Unit
Spool
pcs
Mm
Pack Type
Spool
Spool Type
Sp
Plastic Spool
2.5 Kg Spool
Condition
Solid/Hard
Solder-ready
Paste
New
Flowable
Pattern
Solid
Termination
Solderable
Solder Tabs
Solder
Smd
Crimp
Mounting
Solder Mount
Smd
Self-Adhesive
Hardness
Soft (S-Class)
Soft (~20 Shore)
Soft
Shore D 80
Shore D 75
Shore D 70
Shore D 65
Shore D 60
Shore D 80
Shore A85
Shore A 85
Shore A 60
Shore A 45
Shore A 30
Shore A 15 (Soft)
Shore 00-30
Shore 00 55
Shore 00 50
Not Specified
Low (Flexible)
Hrc 3045
High
Conformable (Soft)
60 Shore A
60 Shore 00
50 Shore A
50 Shore 00
40 Shore A
9 Mohs
Ingredients
Sodium Hydroxide, Steam, Solvents
Reflow
Snpb Recommended
Tape Type
Smt Splice
Compatible Machines
Smt Feeders
Applications
Smt Assembly
Rf Emi Suppression
Reflow, Wave, Manual
Microelectronics, Thermal Bonding
Heatsinks, Processors, Transistors
Electronics, Through-Hole, Repair
Electronics, Shielding, Batteries
Coatings, Adhesives, Encapsulation
Adhesives, coagulant, surface modification, biotechnology
Abrasives, Thermal Insulation, Electronic Substrates
Coating
Smooth
Glossy
Surface
Smooth
Not Specified
Metal, Concrete, Wood, Plastic
Matte
Bright
Cure Time
Skin 10 Min, Full 24 H
Functional 24 H; Full 7 Days
Full Cure 24-48 H
6090 Min At 150 °C
3060 Min
24h Cure @ 23°C
24h at RT
24 Hr @25°C
24 Hours @25°C
24 Hours (25°C)
24 Hours
24 H At 25°C
24 H (Skin)
24 H (Rt)
24 H (Functional)
24 H (25°C)
24 h
2448 H
2-24 Hours (Room Temp); Faster With Heat
Sheet Type
Single-Sided Adhesive
Wall
Single Wall
Layers
Single Layer
Splice Type
Single
Coating Type
Silicone Coating
Modified Alkyd
Acrylic
Preserv.
Short-term
Shore Hardness
Shore D 85
Shore A 85
Shore 00-50
D85
D80
48
35 A
30 Shore A
Form Factor
Sheet
Canister
Gloss
Semi-matte
Semi-gloss
Glossy
Flame Rating
Self-Extinguishing
Backing
Self-Adhesive
Pet Film
Film
Adhesive Type
Self-Adhesive
Pressure-Sensitive Permanent
Pressure-Sensitive
Not Specified
Non-Adhesive
Heat-Activated
Conductive Pressure-Sensitive
Acrylic
Cure Type
RTV (Air Cure)
Rtv
Non-Curing
Neutral Rtv
Neutral
1-Part Cure
Curing Temp
Rt Or 80°C For 30 Min
80120 °C
24h @ 25°C
Active Agent
Rosin-Based Flux
Cure Method
Room Temperature Or Heat Cure
Room Temperature
Ambient Or Heat
Curing Method
Room Temperature
Curing
Room Temperature
Non-Curing
No Cure Required
Air
Cure
Room Temperature
Neutral
Heat Cure Recommended
Air Dry
Class
Rol0
Lead-free
Industrial
Certifications
Rohs, Fda
Rohs Compliant
Rohs
Certification
RoHS Compliant
Rohs Compliant
RoHS
Industry Standard
Compliance
Rohs Compliant
Rohs
Flux
Rma
None
No-Clean T3
No-Clean
No Flux
Halogen-free, No-Clean
Glowcore
Glow 2.5%
Flux-free
Flux-Free
Flux-cored
Frame Type
Rf Shield Frame
Component
Rf Shield
Absorber Type
Rf Absorber
Shielding Type
Rf / Emi
Frequency
Rf
Chemical resistance
Resistant to oils and solvents
Recom. Profile
Reflow 220250 °C
Spool
Reel
Pack
Reel
Jar
Concentration
Ready-To-Use
Ready to use
Conc
Ready to Use
Liquid Concentrate
Ready Mix
Ready To Use
Flux Class
R0 (No-Clean)
J5
Efficiency
Quick Grease/Carbon Removal
Quantity
Price Per Label
500 pcs
4 Pcs
125 pcs
1000 Pcs
1 pc
1 Pc
Dispensing
Precision Tip
Dis
Cartridge Dispense
Cut Type
Pre-Cut Sheet
Application Method
Pouring, Dispensing
Manual Wiping, Swabs
App
Potting, Bonding, Coating
Manual Cleaning
Goods Packaging
Orientation
Portrait
Resin Type
Polyurethane
One-Part Epoxy
Epoxy
Material Type
Polyurethane
Organic Polymer
Coil
Plastic
Spool Material
Plastic
Materials
Pla, Petg, Abs, Tpu
Metals, Polymers
Contact Material
Phosphor Bronze
Mounting Type
Pga
Backing Material
Pet Film
Bottle Type
PET Bottle with Dispenser
Bond Type
Permanent
Price Type
Per Label
Dosage
Per Instructions
Solder Prof
Peak 245-260°C, Reflow
Suitable For
Pcbs, Reflow Ovens, Soldering Irons
Compat
PCBs, Metals, Components
Target
Pcbas
Use
Pcb Moisture Protection
Insulation
Electronics Cleaning
Electronics
State
Paste
Biodegradability
Partially Biodegradable
Solvent Type
Organic Solvent
Isopropanol
Hydrocarbon Blend
Transp.
Optical
High
Opacity
Opaque
Length
On Request
Custom
914.4 Mm
90.00 Mm
66 m
60 Yd (54.86 M)
6.7 m
500 Mm
5.00 Mm
4.57 M
36 Yd (32.9 M)
304.80 Mm
25.4 Mm
25 Mm
230.00 Mm
200 mm
180.00 Mm
180 Mm
150 Mm
150 m
135 m
115.00 Mm
1000 Mm
10 M
1 M
0.866 In (22.00 Mm)
Operating Temp
Not Specified
-55 To +200 °C
-55125 °C
-50°C To 200°C
-50 To 200 °C
-50 To 150 °C
-40°C To 150°C
-40°C To 125°C
-40 To 200 °C
-40 To 150°C
-40 To 150 C
-40 To 150 °C
-40 To 125°C
-40 To 125 °C
-40 To 120 °C
-40200 °C
-40120 °C
-40+85 °C
55 To 150 °C
Flash Point
Not Specified
Non-Flammable
12 °C (Closed Cup)
30 °C
Dielectric Strength
Not Specified
Non-Conductive
Insulating
High
Good
Electrically Insulating
6 Kv/mm
5 Kv/mm
20 Kv/mm
18 Kv/mm
15 Kv/mm
10 Kv/mm
>5 Kv/mm
5 Kv/mm
3 Kv/mm
25 Kv/mm
15 Kv/mm
Cleaning
Not required
Not Required
No-Clean
Rohs Status
Not Compliant
Pot Life
None
Moderate
60 Minutes (25°C)
60 Min @25°C
60 Min
45 Minutes
30 Minutes @25°C
30 Min (25°C)
30 Min
2040 Min (25°C)
2 h
~5 Minutes
Adhesive Backing
None
Venting
Non-Vented
RoHS Status
Non-RoHS
Stock
Non-conductive
Clear, Non-corrosive
Elec. Cond.
Non-conductive
Low (insulator)
Low
Residue
Non-Conductive
Low Residue
Electrical Insulation
Non-Conductive
Electrical Conductivity
Non-Conductive
Moderate
Electrical
Non-Conductive
Insulating
Electrically Insulating
Dielectric
Non-Conductive
Insulating
Electrical Insulating
20 Kv/mm
Designation
No. 2 A
Paste Type
No-clean
Cure Requirement
No Cure Required
Alloy Type
Ni200
Ph Level
Neutral
Alkaline 9-11
Ph
Neutral
Alkaline (9-11)
1213
Cas Number
N/a
Protection
Moisture-Resistant
Moisture And Corrosion
Toxicity
Moderately toxic follow safety precautions
Curing Speed
Moderate
Moisture resistance
Moderate
Activity
Moderate
Medium
Low
Uv Stability
Moderate
Connector
Microfit Compatible
Color Family
Metallic Gold
Suitable for
Metal, Plastic, Wood, Glass
Surface Finish
Metal, Plastic, Glass
Matte
Bright
Cover
Metal Screw Cap
Conductivity
Medium (110 S/m)
Low
High Electrical Conductivity
High
Method
Manual/Auto
Intended Use
Manual Technicians
Target User
Manual Technicians
Thread Size
M10
Resistivity
Low Resistivity (Conductive)
Flux Activity
Low (Rma)
Low
2%
Flux Act
Low (No-Clean)
Low
Dry Solids
Low
Water Absorp
Low
Thermal Impedance
Low
Flux Form
Liquid
Weight
Lightweight
Depends On Size
Depends On Material
8 G
700 G
600 G
500 g
500 G
50 g
5 kg
5 Kg
4.0 kg
4.0 Kg
35 G
250 g
250 G
2.5 Kg
15 kg
120 G
10 G
1 kg
1 Kg
0.75 kg
0.5 Kg
3 g
Roll Weight
Lightweight
Function
Led Potting
Conductive, Antistatic
Lead Content
Leaded
Contains Lead
37%
36%
Standard
J-Std-004
Certificates
Iso 9001; Ce
Certificate
ISO 9001
Ingress Rating
Ip67
Ip Rating
Ip20
Intended use
Industrial application
Heat dissipation
Release Liner
Included
Performance
Higher Performance
High Thermal Transfer
High
Insulator
High-Reliability Silicone
Adhesion
High to metal and glass
High (Metal/Plastic)
High
Good To Metal And Glass
Concrete, Metal, Wood
10 MPa on Steel
1.5 MPa
Metal Content
High Solids
High
90%
88% Wt
100%
Strength
High shear and flexural strength
High
8 MPa (Tensile)
8 MPa
Elasticity
High Elongation
300% elongation
150% Elongation
Adhesion Strength
High Bond Strength To Metals And Pcbs
Shielding Effect
High Attenuation
Chem. Resistance
High
Good vs Acid, Alkali, Oil
UV Resistance
High
Thermal Stab.
High
Thermal Cond.
High
1.4 W/m·K
1.2 W/m·K
1.0 W/m·K
Movement
High
Break Strength
High
Volatility
High
Electrical insulation
High
Elec Insulation
High
Flexibility
High
Flexible
Excellent
Elastic
Shielding Level
High
Reliability
High
Pressure Resistance
High
Moisture Resistance
High
Corrosion Resistance
High
Good
Conformability
High
Compressibility
High
30% Nominal
25 %
Fits
Hand Skin
Halide Content
Halide-Free
Contam Type
Grease, Carbon
Chemical Resist
Good
Container
Glass Jar
Reinforced
Glass Fiber
Board Type
General Purpose Pth
Propellant
Gas
Typical Use
Gap Filling
Pad Type
Gap Filling
Clip Type
Frame Clip
Substrate
Fr4
Wire Form
Flux-Cored
Cleaning Type
Flux And Residues
Cautions
Flammable, Keep away from fire
Avoid Eyes & Skin Contact
Hazard Class
Flammable
Tip Size
Fine
Gender
Female
Print Tech
Fdm
Wetting
Excellent
Chemical Resistance
Excellent
Solder Cl.
Eutectic
Compound Type
Epoxy Compound
Shielding
Emi Enclosure
Effective
Shielding Function
Emi Absorption
Activation
Elevated Heat Required
Sold As
Each Label
Cartridge Type
Dual 50Cc
Storage Cond
Dry, Cool, Anti-corrosion
Dry, Cool Place
Dry Place
Dry cool place
Dark, Dry, Room Temp
210 °C, Dry
210 °C
0-10°C
Storage conditions
Dry, +5+25 °C
Output Type
Digital (Uart)
Electrical properties
Dielectric, 45
Frequency Range
Dc-6 Ghz
100 Mhz 6 Ghz
140 Ghz
Diameter
Custom
5 mm
32.69 mm / 23.58 mm
3.17 Mm
3 mm
218 Mm
2.4 Mm
2.3 mm
2.3 Mm
2.00 Mm
11 mm
1.57 mm
1.55 mm
1.25 mm
1.00 mm
1.00 Mm
1 Mm
0.81 Mm
0.80 mm
0.8 mm
0.8 Mm
0.7 mm
0.65 mm
0.65 Mm
0.64 Mm
0.56 mm
0.5 Mm
0.35 mm
0.025" (0.65 mm)
0.025 In (0.64 Mm)
0,65 Mm
.015 In (0.38 Mm)
Absorber Material
Crs Tin
Conductor
Copper
Melt Temp
Composition Dependent
Approx. 230°C
75 °C
217-220°C
217220 °C
183°C (Eutectic)
183 °C
100°C
227 °C
227230 °C
217 °C
183190 °C
Surface Area
Compact
Dimensions
Compact
82 X 56 Mm
6x6x14 mm
502015 Mm
5.12.5150 Mm
497X1000 Mm
4971000 Mm
406.4 X 203.2 Mm
359.67 X 359.67 Mm
322210 mm
2902901.0 Mm
25158 Mm
229 X 229 Mm
20X10X6 Mm
20\" X 10\" (508 X 254 Mm)
1x2 m
180 X 180 Mm
158 X 148 Mm
150.00 X 150.00 Mm
120201.0 Mm
12 X 12 In
115.00 X 90.00 Mm
100 X 70 Mm
0.728 X 1.156 In
0.445 In X 0.866 In (11.30 X 22.00 Mm)
Display
Color Touchscreen
Indicator
Color Indication
Ionicity
Cationic polymer
Pkg Type
Cardboard Box
Pack Format
Box
Adhesive Sides
Both Sides
Alternate Name
Bergquist Sil-Pad 2000
Melting point
Approx. 217221 °C
Hardener
Amine
Frame
Aluminum
Density
Alloy Dependent
2.6 G/cm
2.5 G/cm
2.1 G/cm
2.0 G/cm3
2.0 G/cm
1.75 G/cm3
1.6 G/cm
1.25 G/cm
1.25 g/cm
1.24 g/cm
1.20 G/cm3
1.20 g/cm
1.2 g/cm
1.21.6 G/cm
1.18 G/cm
1.15 g/cm
1.15 G/cm
1.12 g/cm
1.10 G/cm3
1.10 g/cm
1.1 g/cm
1.05 G/cm
1.02 G/cm
0.95 g/cm
0.951.05 g/cm
0.86 g/cm
~2.5 G/cm
7.3 g/cm
3.9 G/cm
1.16 g/cm (25°C)
1.10 g/cm (25°C)
1.1 g/cm
1.02 g/cm
0.85 g/ml
Hotend
All-Metal
pH Level
Alkaline, 12 pH
5.5
Painting
After full cure
Size
9X9 In (229X229 Mm)
60X60 Mm
5 X 5 Mm
304.80 X 304.80 Mm
125 X 125 Mm
12 X 12 In
1 X 0.38 In
Purity
99.9%
99% Al2O3
99%
99.99%
Sn Purity
99.3%
Tin %
97.0%
63%
Tin
96.5%
62%
60%
Sn Content
96.5%
Formula
951
Area
92903.04 Mm
483.87 Mm
41400 Mm
20700 Mm
129362.509 Mm
Width
90.00 Mm
90 mm
8 mm
8 Mm
50 Mm
5.1 Mm
5.00 Mm
497 Mm
304.80 Mm
3/4 In (19 Mm)
25.40 Mm
25.4 Mm
19.05 Mm
19 mm
180.00 Mm
180 Mm
15 mm
135 Mm
12 mm
12 Mm
115.00 Mm
1 In (25.4 Mm)
0.445 In (11.30 Mm)
0.354 In (9 Mm)
Metal Cont
88%
85%
63% Sn / 37% Pb
Volume
85 Ml
500 ml
50 Ml
50 Cc
5 L
400 ml
400 Ml
4 L
35 Ml
30 mL
30 Cc
3 Ml
25 L
200 Ml
20 ml
100 ml
10 ml
10 Cc
1 L
0.2 L
Shore A
85
48 Shore A
45
Net Weight
84363 kg
700 G
500 G
25 Kg
25 g
1 Kg
0.5 kg
0.2 Kg
Boil Temp
82.5 °C
Molecular weight
800750,000 Da
Coverage
8-10 M/l
810 m/l
68 M/l (Depends On Layer Thickness)
~8 M/l (Single Coat)
0.5 M/can
Sheet Size
8 X 16 In
228.6 X 228.6 Mm
12 X 12 In
Tape Width
8 Mm
16 Mm
Print Life
8 Hours (25°C)
8 Hours
Work Time
8 h at 25°C
30 min @ 23°C
Rate
812 m/l
810 m/l
6-8 m/L
0.5 kg/m @ 1 mm
0.080.15 L/m
Active Ingredient
70% Ethanol
Full Cure
7 Days
Curing Time
714 days
530 Min (Temp Dependent)
24h at 23°C
24h @ 23°C
24h @ 20°C
24h (at 23°C)
24 hrs @ 25°C
24 hrs (20°C)
24 hours
24 h (at 25°C)
24 h
2448h (Full Cure)
Life Time
60 min (at 25°C)
Frame Size
6.0 4.0 Mm
Tie Points
528
Reel Qty
5000 Pcs
Mass
500 g
250 g
20 g
0.03 kg
Coil Weight
500 g
Spool Weight
500 G
1 Lb (454 G)
0.5 Kg
Weight G
500
Bed Temp.
5060 °C
Humid. Lvl
5%, 10%, 15%
Cross Section
5.12.5 Mm
Storage Temp
5-25°C
5 To 25 °C
530°C
525 °C
28 °C
0°C To 40°C
0-10 °C
030 °C
010°C
010 °C (Refrigerated)
010 °C
+5 to +30°C
+4 °C (fridge)
+2+8 °C
Application temperature
535 °C
Working Time
4560 Minutes
30 min
Elongation
400%
400 %
350%
200%
Hole Count
400 Holes
Lead
40%
36%
Weave
4-core
Recoat Time
4-6 Hours
Drying time
46 hours (to touch)
10 min
1020 min
Reset Time
46 h
Cores
4
Lead %
37%
Action Time
30 s
Lifetime
30 min (20°C)
30 min
10 min
Perf
30 min
Print Speed
3090 mm/s
Flux %
3%
3.5%
2%
2.5%
Supply Voltage
3.35 V
Silver
3.0%
2%
Specific Gravity
3.0 G/cm
2.1 G/cm3
1.20 G/cm
1.10
1.051.20
1.03 G/cm3
Bonding Time
34 s
Configuration
2P
1-Piece
Max Temp
250°C
1200 °C
+120 °C
Cte
25 Ppm/°C (2080°C)
Particle
2545 m
Power
24 W
18 W
Reflow Temp
230-250°C
230-250 °C
Build Volume
220X220X270 Mm
Max Speed
220 Mm/s
Solder Temp
220250 °C
Battery Type
21700
Melting Pt
217221 °C
183 °C
Melting Point
217221 °C
217220 °C
217219 °C
183°C
183 °C
156.6 °C
221 °C
217 °C
217220 °C
183 °C
Melting Temp
217220 °C
183 °C
217220 °C
Idh
2165820
Qty
200 pcs
Flux Cont
2% (By Weight)
2%
2,5%
1%
Silver Content
2%
Flux Content
2%
2.5%
2.2%
2,5%
12%
2% (Typ.)
Pitch
2.54 Mm
0.6 Mm
Hole Spacing
2.54 Mm
Silver %
2.5%
Ag Content
2.5%
Ratio
2:1
100:25 (Resin:Hardener)
1:1 by Volume
Componentry
2-component
Shelf life
2 years
Label Size
2 X 1.25"
Tensile
2 Mpa
Cure Schedule
2 H @ 80 C
Current
2 A
<10 Ma
Coats
23 coats
Power Rails
2
Volume Resistivity
1E14 ·cm
1E12 ·cm
Print Temp.
190220 °C
Dimensions Mm
18.50 X 29.36 Mm
Wire Gauge
18-20 Awg
Melting Range
179190 °C
Cure Temp
150 °C
Activation Temp
150220°C
Shrink Temp
120180 °C
Viscosity Cp
12,00025,000
Quantity Box
1000 Pcs
Height
1000 Mm
1.2 Mm
Solids Content
100%
~30% By Weight
88%
Indium Content
100%
Mix Ratio
100:35 (Weight)
100:25 (Wt%)
1:1 By Weight
1:1 By Volume
1:1 (By weight)
1:1 (By Volume)
1:1
Proportions
100:10 (Resin:Hardener)
Pack Qty
100 Pcs
Hum Range
10-60% Rh
Rec. Layer
10-50 µm
Setting Time
10-15 min
Gel Time
10 min
Syringe Volume
10 Cc
Hold Time
1015 min
pH
1011 (1% solution)
Surface Resistivity
1010 /sq
<0.1 /sq
Filament Dia.
1.75 mm
Filament
1.75 Mm
Refractive Index
1.50
Dimension B
1.156 In (29.36 Mm)
Spec. Weight
1.101.20 g/cm
0.79 g/cm
Diameter Mm
1.01
Wire Diameter
1.00 Mm
0.5 Mm
Tensile Strength
1.0 Mpa
~30 Mpa
800 Mpa
Outer Dia
1.0 mm
0.5 mm
Hole Size
1.0 Mm
Hole Diameter
1.0 Mm
Roll Qty
1 Roll
Unit Count
1 Pc
Max Current
1 A
Gel time
124 h (depends on hardener)
Sheets
1
Roll Count
1
Dimension A
0.728 In (18.50 Mm)
Thermal conductivity
0.7 W/(m·K)
Thermal Conduct
0.6 W/m·k
PE Class
0.6
Copper
0.5%
Solids %
0.5%
Copper %
0.5%
Nozzle Size
0.4 Mm
Wall Thickness
0.2 mm
Inner Dia
0.1 mm
0.6 mm
Layer Height
0.10.4 Mm
Diameter In
0.040
Diameter Range
0.0310.79 Mm
Voc
0 g/l
Electrical Resistivity
>=1E12 Ohm·cm
Voc Content
<50 G/l
< 500 g/l
420 G/l
Response Time
<1 S
Accuracy
±5% Rh
±0.5 °C
Tolerance
±0.1 Mm
±0.05 Mm
±0.03 mm
Storage Temp.
+5+25 °C
Storage temperature
+5+25 °C
Apply Temp
+10+30°C
Dielectric Const
~3.5 (1 Mhz)
Shear Strength
~20 Mpa
Temp Range
-60 To 200 °C
-60 to +250°C
-60200 °C
-55 To 150 °C Operational
-50 To 150 °C
-50+150 °C
-40 To 150 °C
-40 To 120 °C
-40 To +85 °C
-4085 °C
-40150 °C
-40+120 °C
-200°C To +260°C
-200+260 °C
-2080°C
-20+80 °C
40120 °C
Min Temp
-60 °C
-30 °C
Temperature range
-60+200 °C
-20+80 °C
Service Temp
-50°C To 200°C
-40 to 120 °C
-40120 °C
Op. Temp
-50°C +150°C
-40200 °C
Operating temperature
-50+120 °C
-40+80 °C
-20°C to +40°C
Op. Temp.
-4080°C
Light Trans
90%
Linear Mass
89.1 G/m
Melt Point
217 °C
Die Shear
10 Mpa
Thermal Resistance
10 °C/W
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